Semi-Dicing System Ceramic Plate Cutting Machine

Applications
Automatic dicing system is widely used in semiconductor chip, LED chip and EMC lead frame, PCB, IR filter, sapphire glass and ceramic thin plate’s precision cutting .
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese, English, Korean, etc.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• High rigidity structure design is adopted to ensure high precision and high stability of cutting process.
• CCD automatic positioning and calibration.
• Real-time monitoring of the air pressure, water pressure, current and other values of the system to avoid spindle damage. • Cutting spindle: 2.4 kw × 1set (Max: 60,000 rpm) • Repeat positioning accuracy: 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Standard collocation blade: 2 Inch (Max: 3 Inch)